Design Of Laser Wire Bonding System And Process Experimental Study

Wire bonding is one of the key processes of microelectronics manufacturing technology.It has the advantages of simple process implementation,low cost,and a variety of package formats.At present,more than 90% of connections use wire bonding technology.The wire bonding includes three methods of hot-pressing wire bonding,ultrasonic wire bonding,and hot-pressing ultrasonic wire bonding,wherein the thermo-compression ultrasonic bonding is used as a main bonding method by most semiconductor manufacturers because of its stable bonding quality.However,exceeding 100 ? high temperature will affect or even damage the performance of the MEMS chip and bring security risks to the chip.Therefore,based on the ultrasonic wire bonding basic process combined with the laser's heating effect and cleaning effect of the material,the study of laser local heating Ultrasonic wire bonding process has important practical value.Firstly,the feasibility of a laser-induced localized ultrasonic wire bonding process is demonstrated theoretically.The mechanism of laser-induced wire bonding was analyzed from the perspective of laser heating and cleaning.The distribution cloud pattern of the surface temperature of the pad under different laser powers was simulated and analyzed using thermal analysis software to obtain the temperature relationship between the laser power and the surface of the pad.Theoretically,the local temperature field satisfying the thermocompression ultrasonic bonding was simulated and the feasibility of laser wire bonding was demonstrated.Next,a laser localized thermogenic ultrasound wire bonding system was constructed.For the needs of the laser wire bonding process,based on the existing manual wire bonding system,a laser wire bonding system composed of a laser loading system,a vision positioning system and an automatic bonding platform system was constructed.Based on the concept of modular automatic control,the design was designed.A corresponding automatic control software system was developed and a fully automatic wire bonding system for laser local heating was constructed.The process of laser wire bonding was simulated using ABAQUS and the motion parameters were optimized.Finally,process experiments were performed using a self-constructed laser wire bonding system.Verify the feasibility of laser wire bonding process,and analyze the impact of laser power on bonding performance,obtain the laser power range of gold wire and copper disk welding,and use this orthogonal experiment to obtain laser power,ultrasonic power,bonding The best matching relationship between pressures,and using the support vector machine regression model to verify the process parameters.