Design And Research Of Three Dimensional Wire Bonding System For MEMS Sensor

With the rapid development of science and technology, MEMS sensors are becoming miniaturized, light and multi-function, which put forward the demand for 3D packaging. The packaging constructions are determined by the mechanical constructions of MEMS devices, which are not standardized. Current 3D packaging technology mainly focused on MCP, SiP, SoP, WLP, TSV, and so on, which tend to be Z directional package structure. It can’t can’t meet the special requirements of MEMS device package. With the application of new materials, new technology, and the improvement of the original technology, the wire bonding technology is still one of the main methods in the advanced packaging. So it is necessary to develop the 3D wire bonding system of MEMS sensor based on the technological maturity of wire bonding and reliability to meet the special requirements of MEMS sensors, which is with great sense.Firstly, the forming process of 3D line arc was preliminary proposed, and the kinematics model of line arc forming process was built based on the forming process.Besides, The dynamic model was built based on the force analysis of line arc. Further more, the simulation analysis of capillary’s movement tracks and the the influence of capillary’s movement on the forming of 3D line arc was carried out, which lays a theoretical foundation for the following construction of MEMS sensor’s 3D wire bonding system.Next,the 3D wire bonding system of MEMS sensors was established according to the capillary’s kinematics and dynamic’s models, and the important components’ performance parameters were determined according to the indexes of process performance. Besides, the key parts was optimized design and its dynamic characteristic was analyzed. Lastly, the 3D wire bonding system of MEMS sensors consist of the model of capillary location,packaging body location, vision system and electronic control system was built.In the end,verify the function of the three dimensional wire bonding system;and inorder to obtain the optimal process parameters for 3D wire arc forming, Then the support vector regression model was chosen to analyze the data of orthogonal experiment and the support vector regression model of three dimensional wire bonding was obtained. Lastly,The vector regression model was checked by a series of single-factor experiments.