Modeling And Simulation Of Plate-level Reflow Soldering Based On Ansys Icepak

With the rapid development of semiconductor technology,the changes of electronic components packaging has promoted the PCB board assembly of high density and more functional.Reflow soldering is the crucial step in the SMT process,but as the miniaturization of electronic components volume and the diversification of material,caused the complexity of the board assembly which put forward higher request of the reflow soldering process parameters optimization.It is easy to ignore the potential risks if only reference to past experience data that higher reliability has not been able to achieve.In order to meet the requirements of the high reliability of aviation products,the modeling and simulation of reflow soldering process was finished by means of computer aided tool about ANSYS ICEPAK in this paper,temperature curve for decision whether to meet the high reliability of aerospace products to provide effective basis.The test board in reflow soldering process has been studied in this paper.The module in reflow soldering,which has high density of components and the quantity of large heat capacity of BGA and the LGA and QFP,due to the limited selection of test points which were selected on the basis of experience in KIC temperature measuring experiment,may have certain blindness,resulting in the deviation to set the temperature curve.To solve these problems,first by the finite element simulation,the temperature field distribution and the stress distribution of the PCBA components were completed under the original welding process parameters.Then through iteration of the simulation model,parameter optimization,and comparing the simulation data with empirical data,verifying the accuracy of the simulation curve,the welding temperature curve finally be qualified.Then using the simulation temperature curve to weld the test plate,through the X-RAY detector,metallographic microscope to analysis morphology of the exterior of the solder joints,solder joint and substrate alloy layer and solder joint between the internal situation.The qualitative analysis was obtained that the formation mechanism of the alloy layer and the peak reflow temperature and the reflux time relationship with alloy layer.Through the combination of simulation and experiments,the quality of the reflow soldering was improved,as well as a reliable method to determine the process parameters provided for the high reliability of aviation products.