Research On Surface Mount Soldering Technology Of XX Circuit Board

In recent years, with the rapid development of electronic technology, the degree of integration of electronic products is greatly improved. Correspondingly, surface mount technology SMT(Surface Mount Technology, referred to as SMT) developed rapidly. Reflow soldering is the core process of Surface Mount Technology, and also it is the most popular and most commonly used welding technology, it is an automatic group welding process, thousands of solder joints once completed in a few minutes,the quality of welding directly affects the quality and reliability of products.In this paper, the surface mount soldering technology of the fixed-type PCB is studied.solder beads producedin the welding process andQPI-5LZ device welding bad, for such welding problems, a research method combined simulation and orthogonal experiment is presented.By using Ansys Workbench simulation software,PCB components were simulated and analyzed,and then observing the PCB component test point heating conditions and the overall heat distribution cloud,orthogonal design was carried out for the conveyor speed and the temperature of the zone.With the help of KIC temperature test software, the actual temperature data of the test points are analyzed,thenthe factors that affect the quality of welding will be found.Through simulation and orthogonal experiment,the problem of XX circuit board welding defect is solved. And the welding condition of QPI-5LZ device is analyzed, which provides the basis for the welding of similar encapsulated devices.And ultimatelyoptimize the welding defects and improve the quality of the welding.