Research On Quality Control Of SMT Reflow Soldering Process Based On The Six Sigma Approach

In the21st century,electronic information technology related to the high-tech industry is developing rapidly. SMT has been widely used in the manufacturing process of electronic products and it has showed a trend of dominant. Meanwhile, electronic products with the characteristics of high integration, ultra miniaturization and high density have put forward move strict requirements of the welding quality of SMT products.Reflow soldering process is the key technology of SMT whose welding process control could directly affect electronic product quality and performance. In order to ensure the good welding effect of electronic products and performance, research related to SMT reflow soldering process has become a major focus in the electronic industry.In order to get good welding effect of electronic products and control quality defects strictly, this research based on six sigma management methods D-M-A-I-C, by solving the problem of SMT reflow soldering process as the research object, improves the technique and technology of the reflow soldering process. The main results of this study are as follows:By using the method of six sigma management, this paper achieves upgrading from qualitative experience to quantitative digital system for SMT reflow soldering process. And this study will effectively cut down the variation and response errors by repeated trial and errors and reduce the waste of material and time. And meanwhile, it also can simplify the reflow soldering process and reduce SMT product welding quality defects.This article mainly has designed multiple sets of DOE experimental projects, in order to find out the influence factors of reflow soldering quality defects. And it has studied on the quality of product defects, by measuring tool analysis, process capability analysis, material analysis and research on the reflow soldering temperature control system. Finally, with the help of simulation temperature curve and PWI management process assessment methods, it finds out the key factors and relevant influence degree.In order to solve the bottleneck problem, the computer reflow process control model is established in this paper. For the connection of product quality defects information with computer language, the matter-element model is built by applying extenics theory. By using the improved PID algorithm and methods to predict energy compensation, it achieves the control of electronic product quality defects and the results are verified in the control stage.