The Influence Of The Test Flow On Test Cost For Mid-bond Test

With the constant development of semiconductor technology,3D SICs(3D Stacked Integrated Circuits)technology has become a hot research,which stacks vertically all different parts of the functional circuit and bonds by interconnect line.Taking into account its complex manufacturing process,process production will go through a detailed test process to ensure that the final chip yield.In order to further improve the testing process,the relvant researchers with the stack process proposed "mid bond test" to improve the testing process.However,it is not obvious that the "mid bond test" for the impact of test costs due to the immaturity of the relevant theory.In order to further improve the "mid bond test" and guide the manufacture of 3D chips more effectively,this thesis makes an in-depth study on the application of "mid bond test".The main contributions and innovation points are briefly summarized as follows.1.This thesis presents how “one testing after the multiple bondings” and “mid bond test” impact the testing process.The method of “mid bond test” is “one testing after every bonding”,it will make some dies repeat testing,and thus the test time increase.In order to avoid the waste of cost,it is necessary to optimize the testing process.In this thesis,we consider the influence of the power consumption and cost on the "mid bond test" stage,and put forward the "one testing after the multiple bondings".Besides,this thesis use the breadth first traversal algorithm on the basis of this model,combined with the relevant parameters of ITC’02 circuit,and the experimental results show that the proposed methods we proposed can not only meet the requirement of the "mid bond test" process,but optimize the test time on the power consumption and cost.2.This thesis presents the bonding order’s impact on cost during the “mid bond test" of 3D chipIn the "mid bond test" process,once the bonding operation fails,it is necessary to discard the completed part,and this cost is hasn’t be reflected in the existing cost model.In order to further increase the cost of production and optimize the cost,this thesis proposed a 3D SICs theoretical total cost model which considers the bonding rate and discarding cost,and on the basis of this model,a 3D SICs optimal bonding order algorithm is proposed.Finally,the thesis also puts forward a method to optimize the mid bond test times.This method can achieve "one testing after the multiple bondings" by replacing the traditional "one testing after every bonding" method.The experimental results show that the method proposed in this thesis is more in line with the actual production,which can guide the manufacture of 3D chips more effectively.