Preparation And Properties Of Copper-Tourmaline Composite Heat Dissipation Materials

At present,the heat dissipation of electronic chips is mainly carried out through heat convection and heat conduction,and thermal radiation as an effective way of heat dissipation has great potential for application.In order to improve the heat dissipation capability of material,from the perspective of thermal radiation,copper-tourmaline composite material was prepared by powder metallurgy method with high thermal conductivity copper whose mass fraction were 15%,20%,25% and 30% as the agglomerant and high emissivity tourmaline as radiator under vacuum condition by high frequency induction heating,which provided a new way for radiant heat radiation material to be used in the heat dissipation of electronic chips.Metallographic microscope and scanning electron microscopy(sem)were used to characterize the microstructure and fracture morphology of the composites.Archimedes drainage method,partial pressure method,temperature measuring instrument,electronic universal testing machine,microhardness tester and some other test methods and equipments were used to test material density,incur density,resistivity,thermal properties,bending strength and other physical and mechanical properties.The results showed that with the increase of adding amount of copper,the copper-tourmaline composite organization became more uniform and dense,the porosity decreases obviously,the heat dispersion performance,incur density,conductivity,bending strength and hardness became better,and the fracture behaviour began to appear ductile.The sintering process had obvious influence on the heat dissipation and density of copper-tourmaline composites.The hardness of copper-tourmaline composites was higher than that of copper 3-5times and increases with the elongation of the heat preservation time.The bending strength of copper-tourmaline composite material could reach 30 MPa which meet the strength requirements of electronic heat-cooling packaging materials.When the copper content reached more than 25%,a certain amount of ductility appeared on the fracture surface of the composite material,the material showed brittleness characteristic as well as toughness characteristic.When the composite material was heated,the copper would play the role of heat absorption skeleton,becoming an effective heat source body by absorbing and storing a lot of heat and heating the tourmaline around it,as a result,the tourmaline absorbed alarge amount of thermal energy and transformed it into far infrared,and then,sent it out quickly.In the case of copper mass fraction were 15% to 30%,the copper-tourmaline composite material prepared under the thermal insulation time of 10 min was higher than0.91-1.55 times the heat dissipation of copper,the copper-tourmaline composite material prepared under the thermal insulation time of 20 min was higher than 0.95-1.78 times the heat dissipation of copper,the heat dissipation properity enhanced with the increase of copper content and the extension of thermal insulation time.