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Keyword [Bending strength]
Result: 1 - 7 | Page: 1 of 1
1.
Research On Properties And Mechanism Of Substrate Materials With Low Thermal Expansion Coefficient
2.
Measurement Of The Mechanical Properties Of The MEMS Materials
3.
The Structure And Properties Of Al/SiCp Composites Preparated By Pressureless Infiltration For Electronic Packaging
4.
Pressureless Infiltration Prepare For SiC/Al Electronic Packaging Materials
5.
Preparation And Properties Of Copper-Tourmaline Composite Heat Dissipation Materials
6.
Multi-Field Fracture Behaviors Of Piezoelectric Semiconductors
7.
The Study On The Polarization And Contact Types Of Piezoelectric Semiconductors
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