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The Research And Design Of Ka Band Tile-type TR Module

Posted on:2018-08-19Degree:MasterType:Thesis
Country:ChinaCandidate:W Y FangFull Text:PDF
GTID:2348330542450276Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
Millimeter wave is between the wave of the light wave and the microwave,with a short wavelength,frequency bandwidth,high angular resolution,narrow beam,strong anti-interference characteristics.It is precisely because of these characteristics,making it in the communication flied has been extensive Attention.Low-Temperature Co-fired Ceramic(LTCC)technology is one type of co-fired ceramic Multi-Chip Module(MCM).Due to it can be integrated into three-dimensional package structure,which will facilitate the integration of the circuit,so it introduced a new design methods and implementation methods for the traditional circuit design.Based on low-temperature co-fired ceramic(LTCC)technology,the high-performance passive devices and microwave monolithic integrated circuit chip(MMIC)with a way of tile-based integration are first placed in different layers in this paper.The layers are then stacked in three-dimensional structure.The entire circuit system is finally constructed with low loss,high reliabile transmission interconnection structure to realize the integration and miniaturization of the Ka band module.The main research works are concluded as follows: 1?The characteristics of MCM and LTCC technology are first introduced;The process steps of LTCC technology are then described.The brick and tile integrated methods are compared to further understanding of the LTCC technology,and to provide a base of the integration and miniaturization of the Ka band T/R module with LTCC technology.2?Based on the theory of transmission line,the three commonly used LTCC transmission interconnection structures,including microstrip line,vertical interconnection hole and bonding wire,are analyzed by tolerance analysis and moudle optimization method,which makes them have low loss and high reliability transmission Characteristic and can be applies to the LTCC circuit of the Ka band.3?The design of passive components based on LTCC technology is studied.With the help of the microstrip probe,a microstrip transition structure(waveguide)with using microstrip probe structure is proposed to realize the connection between the external interface and the LTCC internal circuit.With the help of the high characteristic impedance and slow wave characteristics of the defective ground structure(DGS),the low-pass filter is designed and implemented with integration under LTCC technology.4?The overall design scheme of Ka-band T/R module with the superheterodyne structure of one frequency conversion is first presented by comparing the advantages and disadvantages of several commonly used transceiver.The design steps are then given.The appropriate Ka-band microwave monolithic integrated circuit chip is selected next.The overall system of T/R module according to design ideas is then built.The entire transceiver system is finally simulated with software ADS to complete the design of the entire T/R module.
Keywords/Search Tags:Low Temperature Co-fired Ceramics, Multi-Chip Modules, Ka Band, TR Module
PDF Full Text Request
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