Font Size: a A A

Research On The Key Technology Of Ultrasonic Bonding Acoustic System

Posted on:2017-03-29Degree:MasterType:Thesis
Country:ChinaCandidate:G FengFull Text:PDF
GTID:2348330482987023Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
Ultrasonic wire bonding system is the core component of the acoustic ultrasonic wire bonding machine,and its design and fabrication direct influence the bonding effects.The purpose of this study is to improve the acoustic characteristics and manufacturing methods for the wire bonding acoustic system.The main content of this dissertation is organized as follows:(1)Firstly,the wire bonding art research areas was pointed out.Secondly,the development and trends in the field of microelectronics packaging was summarized.Thirdly,the development and trends in the field of microelectronics packaging was recapped.Fourthly,the research on domestic and foreign wire bonding equipment and acoustic system was reviewed,then the problems were pointed out.Finally,Aiming at the problems existing in the current research,the main research contents of this paper are proposed.(2)Ultrasonic wire bonding acoustic system design.The transducer and the horn of the entire four-terminal network model were established by using four-terminal network method.Then the coefficients of the matrix four-terminal network were derived.The equation of the acoustic system was derived by solving the coefficient matrix parameters.The acoustic system is 64 kHz.Then determine transducer,horn,piezoelectric ceramics and other parts' material,structure,size,etc.(3)Ultrasonic wire bonding acoustic system manufacture.Acoustic systems processing technology was researched.The acoustic system processing difficulty in horn cone surface oblique aperture processing was pointed out by analysing the acoustic system for the processing elements.The oblique hole machining methods and technology was analysed.Then the processing solutions for the oblique hole processing problems was designed.The oblique hole was processed by using ultrasound power sparks composite processing methods.Finally each part of acoustic system was processed and was assembled to a prototype.(4)Ultrasonic wire bonding acoustic system test and experiment.The acoustic system was tested and researched.Firstly the resonant frequency,impedance,quality factor and other parameters of the acoustic system were measured by using ultrasound impedance tester.Secondly,the displacement,velocity,acceleration was measured by using LK-G5000 Series laser displacement sensors produced by Japan Keyence.Thirdly,platinum gold wire bonding experiment was texted.Finally,change chopper overhang was changed,then the finite element analysis of the acoustic system was finished,the variation of acoustic system various parameters by chopper overhang length was summarized.(5)The research work of the paper was concluded.Then the innovative work in this research was noted.Finally the future work was put up.
Keywords/Search Tags:Ultrasonic bonding, acoustic system, finite element analysis, processing technology
PDF Full Text Request
Related items