The Wavelet Analysis Of Ultrasonic Wire Bonding Process Pitch Vibration

This paper was based on the ultrasonic bonding flat and it was main about the influence to the the bonding quality and the characteristic of ultrasonic wire bonding system which came from different capillary mounted lengthes and bonding pressures.The vibration of ultrasonic transducer and its power input were collected by PSV-400-M2 Laser Doppler velometer and its signal collection system.The bonding strength was tested by the Dage4000 Machine. The signals of vibration and electricity were analysed by wavelet.This paper mainly included:(1) Through a mass of experiments the influence to bonding strength by different capillary mounted lengthes and bonding pressures were observed, and the good ranges of capillary mounted lengthes and bonding pressures were obtained,at the same time several explanations to the phenomena were given.(2) The influence to bonding quality and the characteristic of ultrasonic wire bonding system which came from different capillary mounted lengthes and bonding pressures were discussed. The vibration of substrate , ultrasonic transducer and its electronic signal with the changes of the two components were described by using the time-domain statistic methods. The variety trend of ultrasonic wire bonding strengthes with the vibration of substrate , ultrasonic transducer and its electronic signal was discussed.(3)Because of the limitation of the time-domain or frequency-domain methods, wavelet analysis is used to analyze the vibration of substrate , ultrasonic transducer and its electronic signal with different capillary mounted lengthes or bonding pressures in the time-frequency domain. This will offer a new way to understand a bonding process.This paper is based on a great deal of experiments. The influence to bonding strength, characteristic of ultrasonic wire bonding system by the different capillary mounted lengthes and bonding pressures were compared and discussed.The results of this article may be helpful to select a suitable capillary mounted length and the model's parameters of the ultrasonic wire bonding process.