Design And Implementation Of Bonding-head For RFID Tag-Package Equipment

Radio Frequency Identification (RFID) technology plays an important role in information technology. RFID technology has the advantages of high-speed moving object recognition, multi-target recognition and non-contact identification features, which show great potential in development and application of information technology. As storage carrier to be identified, RFID tag is used widely nowadays and the application of RFID tag is steadily increased. Therefore, it is of significance to study manufacturing technology for RFID tag. This paper focus on the design and optimization of mechanical structure of bonding-head module in packaging equipment, in order to achieve high precision and high stability of the bonding operation.Firstly, according to the design figure of the packaging equipment, the design requirement of bonding-head module is a clear aim, and the time and route of bonding module are planned according to process of package. Then the key components of equipment are chosen after calculation and the air channel system is built.Secondly, for the needs of function and placement process, the structural design of bonding-head is initially identified, such as design and layout of the belt drive system, vacuum chamber and seal program, then detailed description of program are given, and the simulation of Statics and Dynamics are used to verify and optimize the design. FEM by Ansys software are used for the base frame, associated with three designs by different materials and different structures, on the static deformation of bonding-head under external loads and stress. And the best program is selected with static analysis results. Adams software is used to simulate the rotary motion, analysis and compare different layout scheme of vacuum chamber. The linear displacement of head nozzle, velocity, acceleration, rotational velocity and acceleration, torque, and Z Force are also thoroughly studied to analyze the motion characteristics and mechanical properties, and select the optimum design.Finally, with the experiment of application of bonding-head, good initial placement conditions of the process are found to ensure the design specifications of equipment to come ture and obtain a higher yield of RFID tag. Including the experiment of relationship between the vacuum drawn of bonding-head and working pressure, the experiment of height measurement and compensation of bonding-head, and the experiment of picking up the chip using nozzle of bonding-head are also done to test the actual yield of RFID tag. The results show that the design and optimization of bonding-head can satisfy the need of yield analysis of RFID tag.