Design And Simulation Of Ultrasonic Wire Bonding Tools For Microelectronic Packaging

In recent years,microelectronic devices with chips as the control center have gradually spread throughout people's lives,affecting all aspects of people's lives.As a major manufacturing country,A country has a slow start in the development of microelectronics,and there is still a big gap between China and developed countries.Therefore,the field of microelectronics has become an important research field for Chinese researchers.Wire bonding is the main packaging process of microelectronics packaging,and has always occupied the leading position in microelectronics packaging.In order to further improve the accuracy of wire bonding,this paper analyzes the key components of piezoelectric ultrasonic transducers through simulation and analysis.Simulation analysis of the motion characteristics of each component structure to explore its impact on the bonding accuracy,so as to improve the bonding quality by optimizing the structure of the piezoelectric ultrasonic transducer.This A first introduces the scientific research background and current research status of the microelectronics development field at home and abroad.According to the various components of the microelectronics field,it focuses on the development of ultrasonic wire bonding and the research status of ultrasonic transducers.According to the research status at home and abroad and some existing problems,the main research content is determined.The thickness-shear vibration state of the piezoelectric ceramic vibrator is analyzed in depth through the equivalent circuit method,and the piezoelectric effect and piezoelectric vibrator are introduced in detail.Related piezoelectric theories,such as the piezoelectric equation,provide a theoretical basis for subsequent simulation analysis.Then,according to the design theory of the transducer,the size optimization and structure design of the piezoelectric ultrasonic transducer are carried out,and the vibration mode of the piezoelectric ultrasonic transducer at various natural frequencies is analyzed,and the piezoelectric ultrasonic transducer is determined The working frequency of the energy device is compared and analyzed between the vibration mode of the piezoelectric ultrasonic transducer in the free state and the working state,and the harmonic response analysis is carried out.Provide data for the following simulation analysis of bond balls and bonding tools.Next,the formation process of the bond ball is introduced,and the bond ball and bonding tool are simulated and analyzed based on the results of the harmonic response analysis of the piezoelectric ultrasonic transducer,and the bond ball is explored under different loading loads.The displacement and equivalent stress of the bond ball are obtained under the loading load,and the vibration mode and working frequency of the bonding tool are determined.Finally,the theoretical analysis of the multiple piezoelectric effects is carried out,and the multiple piezoelectric effects are verified through simulation analysis.The boundary conditions and generation conditions of the multiple piezoelectric effects are analyzed,and the primary piezoelectric effect and the multiple piezoelectric effects are compared and analyzed.The results of the sub-piezoelectric effect explored the influence of multiple piezoelectric effects on the piezoelectric ultrasonic transducer.Using the theory of multiple piezoelectric effects,the idea of developing and designing high-precision micromeasurement instruments and self-sensing piezoelectric transducers is proposed.