Research On The Design Of New Packaging Mold For IC Products

The rapid development of semiconductor industry is driving the progress of semiconductor packaging technology, and high density planar array and surface mount package will become the mainstream of the micro-electronics packaging method. At the same time, with the high attention of environmental protection issues, the environment friendly green epoxy molding plastic is widely used. All of these have put forward new requirements for the design and manufacturing technology of the packaging mold which is closely related to it.The structural characteristics and quality requirements of IC products, the performance of green epoxy molding, high density planar array and surface mount packaging mold are studied and analyzed in this paper. Based on previous experience in mold design and manufacture, with CAD/CAE technology, the design of gating system and exhaust system is optimized. The second ejection mechanism of ejection system is proposed innovatively, which improves the warpage of product, stratification and other undesirable phenomena caused by center position mucous membrane force. Finally the mold design plan and the manufacture craft are confirmed, through the mold and the product processing experiment analysis.In this thesis, from the mold structure design, the design of this new type of packaging mold resolves many problems, such as molding quality and stress control when the green epoxy molding EMC is used, and thus improves the quality and production efficiency. The new type of packaging mold can also expand the scope of the selection of green epoxy molding EMC, reducing the cost of packaging.