Design And Implementation Of Heat-sealing Device For Taping Chip Components

With the wide application of SMT products and systems, the type of chip components is becoming more numerous, heat-sealing quality of tape to some extent affect the performance of element storage, transport and packaging, improve the quality of heat-sealing and adaptability in tape heat-sealing device has great significance. This paper proposes a good adaptability and quality heat-sealing device, and through the simulation analysis and experimental demonstration. The main research work is as follows:Firstly, proposes a heat-sealing device on both sides of the heat sealing knife with adjustable distance. Then according to the design index and the actual condition propose appropriate temperature and pressure control scheme, the temperature control accuracy is ± 1 ° C.Secondly, steady state and transient state thermal analysis results show that: the temperature of heat sealing work surface distribution uniformity, time of heat sealing knife reach target temperature steady state has guidance in practical produce. According to the analysis results of the optimization design of structure of heat sealing module, the surface temperature of heat sealing knife work surface more accurately, and insulation effect is greatly improved.Finally, implement and validate the design of heat-sealing device meet the design requirements. According to heat seal quality evaluation criteria, use the secondary heat-sealed tape obtained by heat-sealing device for film uncovering experiment and surface profile observation experiment, to verify the feasibility of the heat-sealing device and secondary heat-sealing. At the same time, determine the better heat sealing parameters of secondary heat-sealing for different material. And according to the experimental results, optimization design the heat sealing knife wide, add the heat sealing knife adjustment function, then achieve better effect of heat sealing.In short, the heat sealing device has been actually tested with good heat sealing effect and put into practical application, widely used for electronic chip component sealing requirements, and used to similar production process and system.