The Research Of The Reliability Enhancement Test On MEMS Delamination Failure

There are widespread applications for MEMS devices,so their reliability problems have attracted more and more attention. Silicon substrate multilayer structure is an important part of MEMS devices,so its features will directly affect the reliability of MEMS.Delamination failure is a typical failure mode of MEMS. However,the failure mechanism about the effects of environmental stress on MEMS is still unclear. There is no standardized test method as well. Aiming at this problem,this paper introduces RET to study the reliability issues of MEMS. Taking the delamination failure in MEMS devices as the research object,it analyzes the failure mode and mechanism,and establishes thermal, vibration and shock RET profiles. The main research contents are as follows:1. The delamination failure of the silicon microstructure is analyzed. The siliconglass bonding layered structure's problems in the machining process are analyzed in detail.It establishes the correlation matrix of the environmental stresses and failure modes,and thus to determine the RET stress.2. It establishes the temperature cycle RET profile of layered silicon microstructure.The mathematical model of the impact of temperature cycle stress to layer structure is established,and the normal stress,shear force and peel stress distributions of the multilayer structure under temperature cycling load are analyzed. The failure rules are studied.Temperature cycle test of silicon microstructure is carried out.3. It establishes the vibration test profile of layered silicon microstructure. It establishes a dynamic response model and discusses the failure mechanism of silicon micro layer structure under vibration load. It has carried out the random vibration test of silicon microstructure.4. It establishes the shock test prfile of layered silicon microstructure, analyzes its movement characteristics and stress distribution under impact load, and simulates the shock response characteristics. Mechanical impact test of silicon microstructure is carried out. By taking different tests, this paper compares and analyzes samples' failure situations,and finds that environmental stresses have fatigue cumulative effect.