Research On Reliability Assessment Method Of MEMS Components Based On No-failure Data

MEMS components,as a product of the era of science and technology,play an indispensable role in industrial technology manufacturing.Due to the high reliability of MEMS components,often in the process of our limited test products without failure or less that can't get the product failure data,on the basis of the characteristics of MEMS components with high reliability,no failure data of the MEMS device reliability prediction and analysis method has become the main study direction of related experts and scholars.The so-called non-failure data refers to the high reliability of some products to carry out life prediction tests,the test time of these tests by the experimentalists in advance set.At the end of the test,that is,when the product life reaches the preset time,there is no failure or failure of the product.For longevity obey exponential distribution and weibull distribution model of MEMS components appear in the process of test,no failure data,this paper adopts the optimal confidence limit and with distribution curve method,carried on the thorough analysis,in order to draw for MEMS components to try to reduce the test cost and obtain the optimal method for high accuracy of prediction.Firstly,the theoretical basis of reliability prediction is explained in detail,the reliability index parameters of MEMS component life obeying distribution type are listed,and the timing grouping method of MEMS component in truncation life test is introduced.Secondly,in view of the life to obey weibull distribution model and index of MEMS components,the optimal confidence limit method and analysis is introduced with basic principle and the applicable scope of the distribution curve method,applied to MEMS components reliability prediction,the analysis of the effect of experimental group number to predict the results of the analysis,through different grouping experiment was carried out,a best life test group number of MEMS components.Finally,the optimal grouping method for reliability prediction tests of MEMS components with no failure data is proposed,and the future research direction based on the above research topics is proposed.