Research On Reliability Of MEMS Devices Packaging Based On Finite-Element-Analysis Method

MEMS(Micro-Electro-Mechanical-Systems)devices have the advantages of small size,low power consumption,and high reliability.They are widely used in automotive electronics,consumer electronics,aerospace,biomedical,environmental monitoring and information.In order to adapt to the changing market demand,it is necessary to accelerate the MEMS device design cycle,shorten the MEMS device development process,and improve the reliability of MEMS devices.The reliability of MEMS devices is mainly determined by the reliability of MEMS packages.Therefore,in order to ensure the stable and efficient operation of MEMS products,it is very important to study the reliability of MEMS packages.Finite element simulation tools based on process mechanics are widely used in MEMS device packaging process design and reliability research.In this paper,the finite element simulation analysis of the reliability of MEMS device package structure in different environments is carried out.The main research contents are as follows:First of all,through the universal material testing machine,nano-indentation tester,differential scanning calorimeter and other test instruments,according to ASTM,GB/T,ISO and other related test standards to obtain the real thermomechanical performance data of the high polymer involved in MEMS packaging.And a database of MEMS packaging materials is built.Secondly,the finite element software is used to analyze the packaging process of the MEMS pressure module based on the lead frame and the reliability under high and low temperature cycles,and the displacement of the plastic MEMS pressure module at different temperatures is tested by moiré interferometry to verify the simulation results.Aiming at the failure characteristics of the surface mount process of the plastic MEMS pressure module in the post-packaging process,an optimized design scheme is provided through simulation analysis.Finally,the finite element simulation analysis of MEMS gyroscope stacked package structure under five kinds of stress environments: high-low temperature cycling,mechanical vibration,mechanical shock,humidity and energization.Meanwhile,an effective reliability analysis model is proposed for MEMS gyroscope.Packaging process optimization provides new ideas.