Failure Analysis Of MEMS High-g Micro Accelerometer Under Multi-stress Environment

With the widespread application of MEMS devices in various fields,the problem of MEMS failure has become one of the urgent problems to be solved.In the field of military equipment and other applications,temperature,vibration,and shock can lead to structural cracking,output drift,fatigue failure,etc.,and require MEMS to withstand high temperatures,vibration,and shock loads.MEMS high-g-micro accelerometers are the main branch of MEMS.Analyzing its failure is an important part of the reliability of MEMS devices.This article uses a piezo resistive MEMS high-g-micro accelerometer as the analysis object.Firstly,the failure mode and mechanism under high temperature,vibration and impact are analyzed theoretically.Second,through software simulation to simulate the actual use of the environment,the combination of the three in-depth analysis of its failure,can be obtained in a high temperature environment: thermal stress caused by the bending of the beam resulting in fatigue failure and the temperature of the resistance value caused by too much drift and failure;vibration Under the action: gradual and cumulative fatigue failure caused by vibration and shell cracking of the accelerometer;under the action of the impact: failure of the bond wire to fall off and failure of the beam fracture;redesigned reliability under high temperature,vibration,and impact Strengthen the test section,determine the sensitive stress and stress distribution under high temperature,vibration,and shock environment,and evaluate the high g-value micro-accelerometer through Wei bull distribution and other methods.Finally,the failure analysis research of the high-g micro accelerometer is summarized,and the contents of the further study and the direction of improvement in the research of the high-g micro accelerometer are pointed out.