The Research Of Flip Chip In Terahertz Focal Plane Imaging System

Terahertz focal plane imaging systems have wide prospect of applications in security, material as well as military regions. As a result, researches in terahertz imaging are prosperous all around the world. Packaging and interconnection in terahertz systems are facing great obstacles and difficulties by the reason of short wavelength and high frequency of terahertz waves, not only in processing technology, but also in transmission performance part. This thesis devotes in the study of packaging and interconnection in terahertz focal plane imaging system using flip chip technology taking security inspection as application background. The main work are illustrated as follows:1. Determination of packaging scheme and circuits’ interconnection. In order to update to the new tendencies of miniaturization, multifunction, low power consumption as well as high level of integration, flip chip packaging scheme has been proposed to be used in terahertz focal plane imaging systems. In this thesis, characteristics and processing craft of flip chip technology has been discussed. A novel structure of flip chip which is suitable for terahertz imaging receiver has been proposed and validated.2. Analysis of microwave performance in flip chip packaging structure. In this thesis microwave performance of terahertz imaging system has been taking into consideration both in terahertz region and in medium frequency region. The two key researches are analysis of antenna performance in terahertz region and analysis of circuits’ transmission performance in medium frequency region.3. Proposal of overall arrangements of terahertz sensing pixel and array based on flip chip scheme. Based on the influence of flip chip structure on terahertz system, a novel structure of sensing pixel has been proposed. The suggested arrangements of 4×4 array are also proposed on the strength of the structure of sensing pixel.All the above three sections involves the feasibility analysis of flip chip technology be used in terahertz imaging system, microwave performance analysis of flip chip structure as well as the improvement of terahertz sensing chip, which are all the basis of flip chip researches in terahertz region.