Research On The Copper Wire Bonding In Packaging Process

In this article,I expounded the copper wire encapsulation technology research status,studyed and demonstrated the possibility that copper wire insteading gold wire then become the main packaging process in the semiconductor packaging technology through reading a large number of semiconductor packaging technology materials, copper wire packaging reliability related literature.I summarized some key problems of the application and the method of how to solve these problem in copper wire encapsulation technology combined with practical work’s achievement.Problems such as copper oxide and intermetallic compound(IMC). Copper wire is facing the FAB free ball shaping, chip bonding plate aluminum extrusion, bonding pad crater and the bonding related detection methods problem after packaging completion relative to gold because of the high hardness problem. I optimized the process for the ball and wedge,gave the recommonded parameter setting, evaluated copper wire bonding result through product reliability and failure analysis.Also I analyzed the latest material palladium’s related technology advantages and disadvantages which’s cost between bare copper and gold wire. Including the FAB(Free Air Ball)’s repeatability, edm(EFO) influence on the result of the current of the welding layer, aluminum splash. The wedge bonding’s performance, the change of the parameter’s range,copper wire bonding reliability test results, etc.