| Notebook has been developed for over 30 years. With the increasing requirement of the notebook’s comfort, the performance of notebook’s cooling system is getting much more attention. Therefore, to improve the performance of notebook’s cooling system has become one of the most important trends of notebook’s design.In the paper, the finite element analogy is used on one type of notebook and the cooling system performance is optimized in many aspects according to the heat-dissipating test so as to relive the heat, improve the performance and comfort of the notebook.The paper covers the research in several aspects as below:(1) The finite element analogy is used for one type of notebook through FloTHERM software so as to get the result of the temperature profile and temperature of monitoring points(2) The cooling system of one type of notebook is tested and the test result is compared with the finite element analysis, and the simulation parameters is adjusted when necessary in order to improve the accuracy of the simulation results.(3) The influence of the width and thickness of thermal module fins, the position of the heat pipe in the thermal module fins and the position of the fans are analyzed. And the optimization solutions of cooling system is proposed.(4) A lot of optimization solutions are tested to ensure the accuracy of the solutions.We can get the following conclusions based on the finite element analysis on the cooling system of the type of notebook.(1) The best thickness for the thermal module fin is 0.2mm, and the best pitch is 1.2mm.(2) The best position of the heat pipe at the underside of thermal module fin base distance 3mm.(3) The best position of the fan at the underside of the notebook rear distance 0.8mm.(4) After the optimization, the temperature of CPU decreases 4.6℃, the temperature of graphic card decreases 4.2℃. |
PDF Full Text Request