Research On Cooling System Of Portable Laptop

With development of mobile chipset technology and its performance, theoperating frequency and power dissipation of the electronic components aswell is promoted, which result in more heat than ever released during theoperation of the electronic components. However, the production and releaseof the heat affects the stability of the whole computer system and service lifecycle of the product. Especially with the tendency of portability and highperformance for present market, the stable and efficient thermal system isgoing to be a very key technical problem. According to the statistics,nowadays about80%of the computer hardware failure is due to the electroniccomponents failure resulted by the thermal system problem.This thesis is mainly about the optimization design for the thermalsystem of the present portable computer, with the optimized structure designand parameter setting of present thermal system, in order to rationally controlthe temperature of the electronic component inside the system and the surfaceof the mechanical parts, so that the end user can have a good sense feedbackunder computer’s operation mode with high performance.This thesis is based on heat transmission and hydro mechanics scienceand etc., with the software of FloTHERM, to establish the numericalsimulation model of the air flow field and temperature field inside of thecomputer. The accuracy of data from the simulation model is checked throughpractical verify and test of the real model, in order to provide rationaloptimum proposal.This thesis is mainly focused on below research conclusions:(1) Heat-pipe position analysis, the conclusion indicates that when heat-pipe on the fin is located close to the upper and lower sides of Fan airoutlet, the Fan has more air flow and lower noise.(2) To reduce the Fan performance loss, enough clearance needs to bekept between the Fan and the mechanical parts. The experiment data showsthat, the Fan can keep80%of its performance with clearance to be2mm.(3) With consideration of safety regulation, material cost, air pressureat the air outlet, thermal effect and etc., the fin material adopts aluminum, andthe reference thickness to be0.2mm, the clearance to be1mm.(4) The laptop D side is designed with air inlet, in practical case, theair inlet position needs to be properly set up based on the layout of PCBelectronic components, in order that the electronic components with hightemperature can be cooled down, under proper flow fields, after the air flowenters the mechanical parts. The experiment proves that the air inlet setup canbring the airflow to lower the temperature of the electronic components by atleast3℃.