The Study Of 120Gb/s CXP Transceiver Module

As an important photoelectric conversion device, optical transceiver module plays a vital role in area of high-speed optical communication system, which is represented by the data center and supercomputer, and has been widely used in the interconnect communication between large racks. Because of the overflowing increasement of the amout of data, more requirements are provided in terms of communication speed of transceiver module, the existing single-channel 10G module XFP, SFP Plus module and four-channel 40G QSFP module, have become increasingly difficult to meet the requirements of high-speed and high data density. Advances in chip manufacturing technology promote the further development in high-speed and high-channel density area of optical modules.12-channel CXP module, with the characteristics of small size, low power consumption, high integration and high reliability, mostly meets the "high-speed, high-density" requirements of the today’s optical module market. To develop the CXP modules successfully is meaningful for the further improvement of the data communication rate.Three kinds of technologies of the VCSEL array, PIN array and integrated driver chips are used in this project, a new technology called high-density arrays integrated device package technology was proposed at the same time. At last, CXP module samples are developed, which is strictly following the CXP Multi-Source Agreement and IEEE802.3ab agreement.The first chapter introduces the data center systems and supercomputer systems, including its definition, development status and future industrial scale, as well as a brief description of the evolution of optical modules in this field; The second chapter introduces the main technologies the CXP modules used, including the principles, advantages and features of the VCSEL array technology, PIN array technology and integrated laser driver chip technology, this chapter focuses on the relevant specifications the CXP MSA involved in as well; In the third chapter, we described the design of a high-density array of integrated devices, first, theoretical analysis of the coupling theory VCSEL and multi-mode fiber were proposed, then, two ways of the design of high-density arrays of two integrated devices were discussed, last the chip mounting technology were studied; The fourth chapter describes the circuit design, including related functions and circuit structure involved in the driver chip, amplifier chip, and management chip; The fifth chapter introduces the testing and analysis of the CXP module, including building test platform for a full range of CXP sample test, the results indicate that CXP modules fully meet the requirements of the CXP MSA and IEEE802.3ba protocol.