Research On Packaging Technologies Of X Band T/R Module Based On SiP Technology

T/R modules are the core of an active phased array radar. Performances of T/R modules directly affect the overall performance of an active phased array radar.With development of modern radar technology on mobile weapon platforms and the more complexity of target environments, electromagnetic environment of radar-system, T/R modules with high reliability, extreme miniaturization and low cost are in highly demand. Especially for excellent electromagnetic compatibility(EMC) and anti-jamming performance, the modern radar technology is the mainstream direction of the radar development. The emergence of SiP(system in package) can greatly satisfy the requirements of the development of modern radar technology and significantly promote the extreme miniaturization, high integration and high reliability of T/R modules.This thesis focuses on the research of X-band T/R modules based on SiP packaging technology, determines the overall packaging design and EMC design and has finished assembly and testing of the T/R module.First, the packaging design is determined based on the circuit implementation plan. The package is 41mm×41mm×12mm, with 24 I/O ports(21 controller ports and 3 signal ports), and used copper, with plating gold on the surface, as the material of the metal cavity. Given that multiple MMIC chips and other passive components are integrated in narrow space, the EMC design is therefore put forward to avoid self-oscillates.The structure of gold wire bonding is analyzed in detail in order to reduce EMI caused by the discontinuity of transmission lines and find out the best way of wire bonding for the higher reliability of T/R modules.Secondly, the models of transmitter, receiver and the whole package are established by Ansoft HFSS with simulation analysis of eigen mode; The packaging design and EMC design are optimized by eliminating or removing the resonance points of the metal cavity and the influence of apertures of the metal wall is simulated for the assembly and testing purpose.Finally, the assembly model is designed by Solidworks and AutoCAD for subsequent processing and Encapsulation testing is finished for verifying the packaging design and EMC design.