Research On IGBT Driver Module Packaging And Testing Technology

As the mainstream product in current power semiconductor devices,insulated gate bipolar transistors are known as "the most complete" semiconductor devices.It is the core technology for power conversion and control,and its performance directly determines the energy consumption,efficiency,reliability and cost of the entire power electronic system.Therefore,it is widely used in rail transit,new energy,AC frequency conversion,wind power generation and other industrial fields.With the rapid advancement of military weapons,ship power,missile launch vehicles,tank control systems,radar power supplies,etc.all put forward more high requirement for IGBT modules.The module generates a lot of uncertainties in the module due to the heat generated by the power cycle during the actual working process.Due to the multi-layer package structure of the module,it is bound to be affected by the parameters in the welding process and the reliability problems caused by the thermal cycle.Therefore,the steady-state junction temperature and stress distribution of the simulation model simulation module are established.At the same time,after completing the package,the module needs to test various parameters of the module to verify whether it meets the research and development requirements.Static and dynamic parameter testing of the module is required.Therefore,based on the research progress of combing IGBT module,this paper analyzes and studies the packaging and testing technology of IGBT module,the traditional solder paste process is replaced by solder sheet without flux,which eliminates the link of ultrasonic cleaning,shortens the process flow and avoids the damage of module caused by ultrasonic cleaning process.Exploring the parameters of the two welding methods and analyzing the welding results,finally determining the welding method as two welding processes.Determine aluminum wire bonding parameters and perform tensile testing,Test the dynamic and static parameters of the packaged module,Test results are within the allowable range.Finally,the reliability test is carried out to test the module for high and low temperature parameters and temperature cycle test.No significant defects have been found in the module,indicating that the packaging process in this article is reasonable and reliable.