Risk Management Of New Material Phase In Process Semiconductor Assembly Project

This paper presents fundamental theories and development history of project risk management as well as its research status at home and abroad. Technical risk sources of semiconductor packaging new material phase in process are identified with our company experience recent years no matter failed or succeeded. Base on theories and methods study of project risk management and general process for new product phase in, procedures for introducing new package material in semiconductor industry are established and frameworks for risk management in new semiconductor package material introduction process are formed. In order to find more efficient approaches for technical risk management during semiconductor package material introduction, some methods to improve risk management during new semiconductor package material introduction process are explored, including quality function deployment to transfer end customer requirements into process parameters and material characteristics, identify risk sources then sort them, and failure mode effect analysis table to identify and measure risk factors, then provide solution or mitigate plan for each of them individually. And base on the phase in process of a new film material, the main contents for risk management in semiconductor new material phase in process are introduced, apply procedures and its effectiveness in this film introduction process are described, which proves the operability of this risk management model, procedure and methods. Finally, experience and enlightenment are summarized base on this risk management application of semiconductor new material phase in process.The paper conducts both theory research and case study, giving much more helpful model and broadens the way of thinking for risk management in new semiconductor package material phase in process, presents good trials and exploration for systematic risk management development in semiconductor package industry, hope it can broach the widely application of risk management in semiconductor package industry.