Research And Verification On Test Method Of MCU USB Module

In recent years, following the Moore law, IC industry has experienced rapid development and until now it enjoys gigantic scale, along with complex process and circuit structure. While the integration of IC is growing continually and its performance keeps becoming stronger, its size becomes smaller and smaller. These circuits, with large integration, get connected to external circuits by pins in limited quantities, which bring many troubles for us to estimate the quality of IC. In the other hand, with the continuous development of the technology of IC, especially the growing functions of EDA aided design tool, the design of IC becomes increasingly automatic and the production cycle of its product design gets increasingly shorter. And all these need the work of chips testing to be finished as quickly as possible. Both traditional test model and test method cannot serve to the needs of current test, so we are in sore need of improving the efficiency and reliability of IC test. At present, the theoretical study of testing technology and design for testability(DFT) has become one significant study direction in the fields of chips, thus researchers are required to put in more effort to improve the reliability of the test and at the same time lower its cost.This paper aims to make a certain amount of research on how to improve the efficiency and reliability of IC test.First of all, this paper introduces the cause of common pitfalls in IC manufacturing, and analyzes some common fault type caused by physical defects. Then, it makes introductions on the cause and test methods of Stack-at fault, Stack-open fault, Stack-on fault, transition fault and bridge fault in detail, and briefly acounts the principles and objectives of DFT. Then, this paper makes detailed research on the test of USB modules, for USB modules play an important role in MCU chips and the quality of its performance influences the availability of the chip directly. Test for USB modules takes up the important part in the process of MCU chip testing. Furthermore, this paper makes the design that before taping out, we do prototype verification for USB modules on FPGA and, after taping out, make another test on USB modules on EVB board. In this way; it improves the success rate of taping out by 30%, lower the error rate of USB modules by 10% and shorten its test time by 50% compared with the traditional test method.On the basis of the introduction of USB communication protocol in chapter3, and configuration of the PFGA clock in the chapter 4, this paper makes tests of USBmodules on FPGA and EVB board respectively and conducts intensive study on how to transfer ASIC design to FPGA design to do prototype verification. Through study and analysis the test results, and compare with the traditional test method, it proves that prototype verification combine with board test is better than traditional test method in large ICs.In a word, this paper combines prototype verification and board level test to ensure the success rate for taping out, to reduce the difficulty and improve the efficiency of chip testing. Through the test, this paper proves that the USB module works normally, and prototype verification combine with board test is a good test method for large ICs.