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Research On The Quality Inspection Mechanical System Of CMOS Camera Module

Posted on:2014-07-09Degree:MasterType:Thesis
Country:ChinaCandidate:G WangFull Text:PDF
GTID:2268330425993467Subject:Instrument Science and Technology
Abstract/Summary:PDF Full Text Request
CMOS Camera Module chip is core of the camera, it has been widely used since a large number of camera phones came into the market. Then the inspection of chip quality has become very important. Currently, artificial inspection has been unable to meet the production demand and product quality requirements, need to be developed for testing the performance index of automation equipment. For the lack of manual inspection of the CMOS Camera Module chip, this article on the design of the overall structure of the COMS camera module quality inspection system. The system is capable of automatic loading by the robot, and automatically detected by the light box on the chip, then unloading automatically by the robot and sorting the failed chip. This article focuses on the structure of the internal of the light box and automatic feeding robot. And use Solidworks to create a three-dimensional model of the CMOS Camera Module quality inspection system. Finally, this article analyze the positioning accuracy of the automatic feeding robot.
Keywords/Search Tags:CMOS, Camera Module chip, mechanical displacement platformthree-dimensional modeling, accuracy analysis
PDF Full Text Request
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