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Uncooled Package Module Research On High Power Fiber Coupling Ld Useing Polarization Multiplexing

Posted on:2014-11-03Degree:MasterType:Thesis
Country:ChinaCandidate:Y PangFull Text:PDF
GTID:2268330425493172Subject:Optical Engineering
Abstract/Summary:PDF Full Text Request
Along with the wide application of semiconductor laser in pump laser, plastic material welding, medical, marking, night vision, guidance and other areas.Its requirements on beam quality, power density, brightness are more and more needed. Beam quality can be improved greatly by Hight power semiconductor laser and fiber coupling. Power density can be improved relatively by using more small core fiber. Multiple single emitters combined can realize high brightness output.In this paper, cylinder lens are used for compressing beam in fast axis direction. LD has high linear polarization, so the backlighting road of Polarization Beam Splitter be used for combining the two orthogonal beams which are collimated. Then output a high power beam that has the same direction and position. Zemax software is used for designing the reasonable parameters of focusing lens, in order to meet the focused beam can enter into fiber.Ansys software is used for thermal analysis of laser chip. module that is cooled with heat conduction adopt flip chip technology. AuSn solder is used to weld chip and copper heat sink.Used F-mount method for packing. A uncooled packaging module of high power LD couple with fiber has been designed.
Keywords/Search Tags:beam combined, collimation, fiber coupling, uncooling
PDF Full Text Request
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