Research On Design And Analysis Of Key Component In Electronic Device

With the increasingly intergration and power consumption of modern electronic devices, the thermal flux density is also rising sharply.If the engineers do not pay attention to designing the heat dispersion of electronic devices, the quantity of heat produced by the components will not be effective controlled. The operation temperature of ome components is capable of increasing,It may result in the instability and invalid of whole electronic system,especially to some complex electronic devices or in the severe working environment.This thesis focuses on the thermal analysis to heat dispersion of DM642, which is the key chip of the infrared thermal imaging device circuits. With fully understanding the device performance, characteristics, operation temperature and other exterior factors,the heat produced by the device is estimated and the cooling mode is selected.At the same time the factors effecting heat dispersion is analyzed in theory and entity model for thermal analysis is also established. On the basis of proving validity of using ANSYS,large engineering software, to thermal analysis, the temperature field distribution of DM642and its heat sink are solved. The influence caused by heat sink structure changing on DM642temperature field distribution is also simulation by this software. Finally, the heat disperation structure designing of the devices is finished according to the simulation result.In the thesis, the application of ANSYS to thermal analysis not only explores the application characteristic on solving complex project, but also provides important reference on electronic deviceeliability design, and establishes basement on achievement of computer aided design to electronic device.