Thermal Analysis And Heatsink Structural Design Of LED Microarray Device

The LED microarray chip with MOEMS technology directly produce a number of regular arrays of tiny light emitting cells on a monolithic semiconductor epitaxial wafer, forming a two-dimensional LED array structure. Compared with the traditional LED chip microchip has the advantages of high integration, high luminous efficiency, high brightness, and has broad application prospects in the fields of display, lighting, communication and so on. With the increasing of the number of LED array chip unit and the power of the device, the heat dissipation of the chip becomes more and more important, and has become one of the key factors which restrict the development of LED microarray chip. Therefore, it is of great significance to analyze the thermal characteristics of LED microarray chip. In this paper, a finite element thermal analysis model is established for the AlGa InP-LED microarray, and the method of the establishment of entity model, the grid division and the boundary conditions are introduced. The temperature distribution of device working with a single unit and 3 × 3 units is respectively analyzed by simulation. The microarray model is simplified by calculating,and the simplified model is more suitable to calculate the temperature field of large size array. The results show that the simplified model is 0.8% at 1.5s. Using the simplified model, the temperature distribution of the chip with the size of 10mm×10mm×100μm and 104 units was calculated, and the center temperature of the chip reached 360.6℃ at 1.5s. In order to solve the problem of heat dissipation, two finned heatsink were designed, and the impacts of heatsink structure, adhesive material, and number of fins on the temperature of chip were simulated.