Design And Implementation Of Digital T/R Module Based On MCM-l

In order to face the increasingly complex operational environment, MIMO, a newsystem of radar, has excellent performance in low, small and slow target detection,anti-saturation attack, RF stealth and anti-jamming and other aspects, andhigh-performance digital T/R modules in the new system of radar such as MIMO radarplays a key role. Digital T/R modules requires the function, which is generation avariety of complex the radar waveform, and at the same time in order to reduce systemsize and power consumption, uses high-density multichip modules package to improvesystem stability and reliability.Currently, T/R component with high-density packaging of multi-chip module hasmainly put into use in the part of RF, which applys rarely in the part of digital. The timeof multi-chip module technology development is still relatively short, which needs to beinvolved in many of the technologies, such as microelectronics technology, integratedcircuit technology, materials technology, micro-welding process. In addition, somecountries blockade the related technologies, so that the domestic technology ofmulti-chip module is still in its infancy. The technology readiness levels of MCMpackaging of domestic digital T/R module is at2.Undertaking research tasks in this thsis is to design digital T/R module with twotransmit channels and two receive channel, which requires the ability to produce avariety of complex and flexible radar waveform that can be controled in real time basedon the different experimental conditions, and takes advantage of the multichip moduletechnology (the technology of multi-chip module in this system design is MCM-Ltechnology) in high-density packaging of the entire system, and ultimately forms thestructure of the3D-MCM. The part of radar waveform generation uses the program ofAD9910, which can be controlled by host computer to generate radar waveform in realtime. Based on the reasons of current domestic technical and the actual situation, thedigital T/R module hardware modules will be reasonably allocated to four substrates,which still use PCB board with RF4material, the substrates will be connected with FPCof polyimide materials in space and eventually assemble into the structure of the 3D-MCM. In the structural designing process of digital T/R module multi-chip module,it is necessary to pay attention to the interconnected relationship between the substrates,the power consumption balanced, the interface distribution, electromagneticcompatibility, signal integrity, heat and other factors, at the same time we mustunderstand welding, appropriate materials, level of technology and other relatedtechnology.