Thermal Model Analysis Of Airborne Electronic Chip

Airborne electronic chip is the ubiquitous heat source in the airborne electronicinformation system, the heat generated from the chip is an important parameter for theestimating system heat indispensably. However, the electronic chip manufacturer cannot offer the complete chip heat parameters, especially when running a special programin the non-full-load condition, the chip heat will be much below its rated maximum,therefore, it is not necessary to design a full huge cooling system. To reduce the scale ofthe radiator of the cooling system can effectively reduce the load of airborne.This article researches chip based on the heating mechanism and the packagefeatures of the chip, and uses computer system simulator to estimate the chip heat that isproduced by running the specific program, and then proposes using reverse engineeringmethod to verify the calorific value. Firstly, build the chip model in the thermalsimulation software, and calibrate the accuracy of the model thermal boundaryconditions. Then proposes the algorithm of temperature moments used to solve theunknown heat source region on the basis of the temperature data by test and thermalsimulation analysis. Finally, based on detailed parameters of electronic chip model,estimate instance of chip thermal power consumption in the case of non-full loadrunning, build a thermal simulation analytical model by Flotherm, find the reasonableresults and verify the correctness of inverse engineering method. This paper shows thatusing computer system simulator to estimate chip heat is an effective supportingpathway in thermal design.