Research On Reconfigurable Temperature Measurement Technology And Engineering Application Based On FPGA Modular Design

Field programmable gate array(FPGA)has many advantages,such as flexible application,low cost,fast operation speed.It is widely used in the fields of communication,test and measurement,IC design and so on.With the shrinking of semiconductor process,FPGA integrates large-scale programmable logic resources and intellectual property(IP)cores,and application of the chip is becoming increasingly complex,that lead to more power consumption,The FPGA chip temperature is also getting higher.Increasing chip temperature is a major reliability concern since various failure mechanisms are accelerated at high chip temperature,which brings more challenges to the chip reliability.Therefore,the research on the characteristics and applications of FPGA devices has become the focus of people's attention.In this paper,FPGA are studied on temperature rise characteristics and application characteristics.On temperature rise characteristic,transient temperature of FPGA is measured based on the linear relationship between the cycle of the oscillator output frequency and temperature,and an optimization method for ring oscillator(RO)-based thermal sensor allocation is proposed.On the engineering application,the system of the multi-channel thermal resistance measurement timing control circuit based on FPGA is designed by using modular design method.Specific research contents include the following aspects:1.An intelligent thermal sensor network allocation optimization method based on fuzzy clustering algorithm is proposed.Sensor arrays are evenly distributed on the FPGA as the original layout.We analyzed temperature in both temporal and spatial domains for widely different application,and the optimized allocation is a result of a trade-off between the number of sensors and the measurement resolution.The thermal sensors are combined based on their mutual clustering levels,which is suitable for various applications on FPGA.The experimental results show that when the temperature gradients range from 0°C up to 40°C on an Altera Cyclone IV FPGA,the optimization method can save up to 37.5% sensor resources while maintaining the measurement resolution of 1°C.2.Combined with FPGA power consumption analysis,the relationship between the use of chip resources and the temperature rise is studied.A self-heating test module that uses the FPGA resources to generate hotspots and large temperature gradients for measurement validation is presented,which is used to simulate the temperature rise during the operation of FPGA to verify the thermal sensor distribution optimization scheme.3.A multi-channel thermal resistance measurement timing control system is designed by taking FPGA as the kernel control chip.Using the idea of modular design,the single channel measurement system is divided into several functional modules,which are completed respectively and then merged into the top-level module.Finally,the multi-channel measurement timing control system is debugged and verified.Using this method,the measurement timing control system of the VDMOS+2 LED thermal resistance and the 8 semiconductor components thermal characteristics are realized.