Structural Thermal Analysis,Optimization And Experimental Study Of Low Temperature Co-firing Ceramic Circuit Boards

Low-temperature co-firing ceramic circuit boards have the advantages of high frequency,high speed and high reliability,and can be used in high demand applications.After decades of research and development,it has been widely used in RF,microwave,communications,medical electronics and MEMS and other fields.Under the action of thermal environment,the Low-temperature co-firing ceramic circuit board will have a large deformation and thermal stress,resulting in cracks on the surface of the circuit board,affecting the normal use of the circuit board.In this paper,the surface flatness of the circuit board assembly after welding is simulated and tested.And the structure of the circuit board is optimized to improve the mechanical properties of the circuit board in the thermal environment.Finally,the digital image correlation measurement system is used in the thermal test of the circuit board components,and the test results are compared with the simulation results.This paper expounds the influence of thermal environment on electronic equipment,masters some thermal test analysis;and outlines the fabrication,function and characteristics of low-temperature co-firing ceramic circuit board.The related theory of heat transfer is expounded,and the theoretical analysis and simulation of thermal convection of plate structure are made by using the theory of heat conduction and finite element simulation software separately,and the results are compared and analyzed.The finite element model of the circuit board component is established,and the simulation software is used to simulate the circuit board component.And compare the results of the flatness analysis with the outcomes which are measured by the contact three-dimensional coordinate measuring instrument.In order to improve the mechanical properties of the circuit board in thermal environment,the structure of the circuit board is optimized.In the optimization,a single-objective genetic optimization based on the maximum thermal stress of the circuit board and a multi-objective genetic optimization based on the maximum thermal stresses of three local fillet on the circuit board are adopted.Finally,compare and analyze the two optimization schemes.To investigate the deformation of circuit board components in thermal environment,a set of thermal experiments are carried out in the paper.After the completion of the thermal experiment,compare and analysis the experiment measurement results with the finite element software simulation analysis result.