Research On Parameters Change Mechanism Of Typical Components In High Temperature Environment

High temperatures is main reason bad reliability for electronic equipment ,theresearch and development of electronic products that can still operate normally in the hightemperature environment is regarded as one of the key technology of this century. Therefore,research on effective test method and dynamic parameters test method of the typicalelectronic components in the high-temperature working conditions , through on-line testresearch on change law that electrical performance parameters of electronic components inthe high temperature environment forces , and combined with finite element simulation,analyzing the potential failure mechanism of typical electronic components , and puts forwardthe corresponding prevention measures, it has important significance to ensure to realize highreliability requirements of the electronic products in a harsh environment .This article chooses the high temperature stress field as electronic components researchenvironment, through analyzing its characteristics, and sure to study by step into the stresstest as test method. For the chance of main characteristic parameters of electronic componentsunder the stress field, the appropriate test circuits are designed to make the measurement.Through the simulation analysis of the test circuit , the test circuits are verified andoptimizated.To a metal resistance, chip resistor, tantalum capacitance, chip capacitor and other typicalelectronic components，the experiment about characteristic parameters in the environment ofhigh temperature was done, and high temperature experimental data of typical militaryelectronic components was got.Based on high temperature testing results,the parameters change rule and characteristicwere analyzed about the typical military electronic components in high temperature condition , and the characteristic of the temperature was researched on，and based on this, componentschange law and mechanism parameters are discussed in high temperature (125℃~ soldermelting point) .Based on the existing test data, and by using the finite element multi-physical technologyelectronic components physical models were built.By using the finite element analysissoftware COSMOSWORKS material parameters were setted, temperature stress fieldenvironment was simulated and meshed. The components was simulated and analyzed.Through the thermal stress simulation results, elements from the stress and strain conditionwere analyzed, and the simulation analyzed the failure of typical components occurrence anddevelopment process in the high temperature of strong stress field environment in order toverify the dynamic testing experiment test results.