Design And Implementation Of Hot-pressing Module For RFID Tag-package Equipment

At present the application of the radio frequency identification technology is used widely, and the demand of RFID tags is growing rapidly, therefore, it is very significant to do the research and development of RFID tag-package equipments. As an especial package-way of RFID, Strap-package has many advantages and represents a development tendency. This paper mainly states how to design the hot-pressing module of Strap-package equipment which is based on ACA packaging technology, focusing on design of the hot-pressing bonder which is the key components of hot-pressing module.Firstly, the design requirement of hot-pressing module is created according to the design figure of the equipment, and the time and route of hot-pressing module are planned according to antenna distribution of Strap substrate. Then an initial plan of hot-pressing module is created.Secondly, the control scheme of the hot-pressing bonder is designed according to the requirement of thermal and pressure precise control, and they are verified through the experiment.Thirdly, the finite element model of the thermo-compression bonder is created, and the structure of hot-pressing bonder is optimized according to the analysis result. An excellent hot-pressing bonder is created after a series of improvements. The results of the finite element analysis are verified by the thermal experiment. Through the actual package experiment, the designed bonder has reached the design requirements which are proposed in this paper.Finally, hot-pressing module is designed according to the design requirement, and the autochart of hot-pressing process is achieved.