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Design And Experiment Of Temperature Control System Of Die Bonder

Posted on:2005-01-26Degree:MasterType:Thesis
Country:ChinaCandidate:J F YuanFull Text:PDF
GTID:2168360122992400Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
With the fast development of LSI and VLSI, microelectronics manufacturing characterized by IC manufacture and encapsulation has become a fast-developing and influential high-tech industry. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. Temperature control system is one important part of it. The control accuracy, robustness and stableness of temperature systems are crucial to improve the weld quality and reliability of silicon chips.On the basis of researching PID control and its self-tuning methods, fuzzy self-adaptive PID control methods, the transplantation and software development of embedded real-time operation system and other aspects, a temperature control system is designed and tested for the die bonder. The main contents include:With combination of Z-N PID self-tuning formula and relay self-adaptation control methods, the PID parameters of weld area of furnace is given automatically. On the basis, fuzzy self-adaptive PID control methods are applied, the fuzzy rules for dynamic modification of PID parameters are established to adjust PID parameters online. Those enable the system with better robustness and preciseness of stable status.The hardware of the temperature control system is designed. The introduction of K-type thermocouple and the usage of MAX6675 which is its specific IC are presented. The user input and power output circuit is designed, and the selection of microprocessor and other aspects are introduced.The features, parts and task scheduling method of embedded real-time operation system μ C/OS-II are introduced first. On the basis of familiarity with the kernel structure and the principle of ICCAVR C compiler, the transplantation of u C/OS-II to ATmega128 is finished and the system tasks are programmed.Finally, heating furnace and the serial interface data collection tools written by VC are designed to test the performance of the control system. The results show that the temperature control system can meet the requirements better.
Keywords/Search Tags:PID, Fuzzy Self-tuning PID, Die bonder, Temperature, μC/OS-II
PDF Full Text Request
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