The EMC Design Of HDI Board

In recent years, with the rapid development of the electronics industry, printed circuit board industry is rapidly developing its application requirements is also increasing. The traditional single-sided, double-panel has been far from satisfying the demand, multilayer, high density interconnect board has been widely used in high-end electronic products. Also, because the work of electronic equipment become increasingly complex electromagnetic environment, electromagnetic compatibility of electronic products design is also a higher demand. Printed circuit board as nearly all electronic products, electronic components of the carrier, its own direct impact on EMC performance of electronic products, and thus, PCB EMC design their own machine will play the electromagnetic compatibility a crucial role. High-density interconnect PCB board embodies the contemporary design of the most advanced level, it brings the device-intensive technology, fine wire, aperture small, and its own EMC design has become the design and development by many research focus.Mobile phone and other small, complex electronic device represented by the product, has its own printed circuit boards made of electromagnetic compatibility of urgent needs. Excellent research and design to meet the EMC of HDI mobile mainboard is the main thesis.This paper from the PCB development and current situation began with a typical transmission line theory mode, parasitic capacitance mode, inductive coupling and electromagnetic compatibility of the relevant theory, from the laminated structure design, SI design, PI design, grounding design, several important aspects, in order to meet its own PCB for the purpose of EMC, to study and design of a smart phone, high-density interconnect the main PCB. Paper first outlines the printed circuit board to the development of high-density interconnect board process, the design of HDI board Research and the paper needs major work done. Then, from the typical set of transmission line mode, on the design of HDI board structure and the theory of EMC related to do a relatively specific description. This paper is part of the design from the stackup, impedance line design, signal reflection, crosstalk and other signal analysis and resolution of key issues, and analyzes power integrity design, including the power supply side, power lines and grounding design and analysis of relevant theories and for practical application, using CR5000 computer-aided design software, design a smart phone with HDI board. Finally, the paper concluded.The specific design of the project process, using a variety of different structures of mainboard design, and optimize the best design out of the debug process to address the main PCB development process necessary for key technologies, including 1) signal integrity design, RF line, clock lines, data lines, audio lines, a key part of the differential lines, the layout and routing; 2) power integrity design, power side and the design of the power cord, power supply side of reasonable segmentation; 3) grounding, single-point grounding and multiple points ground, the ground plane processing; 4) In order to promote the fast and wide application of this innovative design a second-order HDI board structure, in the context of the indicators to ensure can complete the board design faster and achieve better electromagnetic compatibility.Through the intelligent dual-mode dual standby smart phone board design, development, and through repeated testing and certification, innovative design, a good performance, convenient high-density interconnect board of the design structure, the hardware development for other similar products laid the foundation. Use this motherboard design structure and layout of the wiring pattern, you can minimize design cycles and costs, companies according to market demand, therefore, in a relatively short cycle, with relatively few human development indicators that meet the performance requirements the stability of mobile devices, to capture cell phone market.Intelligent dual-mode dual standby mobile phone product design and development has been basically completed and the actual network and application debugging on the performance index stability. The successful design of the project, as many board-type structure can provide a reference for the template, bound to promote and facilitate the printed circuit board industry even faster development of the electronics industry. The development of high-density interconnect board is in the ascendant, a wide range of prospects, and board-level EMC design is the most direct and most economical design methods must be widely promoted and applied.