Study Of Theory And Application Of High-precision Laser Cutting Technology

The laser cutting technology gets broad application for its incomparable advantage, the high-precision laser cutting has the vast application prospect more. In this paper we take StencilCut series laser cutting machine of Shenzhen Musen Technologies as example, analyze the method and influencing factor of focus precision, structure precision, control precision from laser aspect, assistant medium, machinery structure, electronic control and software five aspects, study the influence of system parameters. Then we use all-solid-state ultraviolet laser to cut the silicon wafer, electronic ceramics, sapphire, BST thin film, PCB and so on. Through the theoretical analysis of high-precision laser cutting, we provide the basis for the selection of parameters in practical applications. We study the laser cutting under water detailedly, push it from the laboratory to industrial production, and the technology applied for an inventive patent. We use UV laser to scribe the BST thin film in the KOH solution, achieved very good results, and it is used to manufacture the equipment. By cutting a wide range of materials research, verify the correctness of the theoretical analysis, accumulate the applications experience of all-solid-state UV laser, all of the experimental materials are used in the practical application.