The Microwave Power Module Assembly Technology

The assembling technology is one of the important technology of Microwave Power Module (MPM) reliability, because of the high frequency and power, the requirement for the assembling technology is very high, it is necessary to research the assembling technology of MPM.This paper is focused on the research of the MPM of TR module fabricated by 14th institution. First, Thermal design and the method of testing were introduced by studying the theory of thermal and electromagnetic compatibility, design principle was discussed combined with the design for electromagnetic compatibility, and DFM technology of MPM was studied. Second, Ground technology of MPM was studied, mount of experiment of Large-size soldering and the ground technology of hollow pin approved that high reliability of Ground technology could be obtained through 2/3 hollow area stencil paste and 10g/cm2 power. Design, fabrication and process of hollow pin Ground technology were introduced, and its High reliability was approved by experiment. Third, Bolt connection technology was studied. Efficient method to avoiding release of bolt was asked by studying the failure mechanism in order to obtain high quality of bolt connection of MPM. forth, Failure mechanism of assembling technology of MPM and carrier bord was studied. Finally, Several parameters influencing microwave lost were founded by modeling, emluator and data processing. Feasibility and reliability of Mounting technology of MPM and carrier board was approved by the actual sample designing, assembling and testing.