Millimeter-wave Ltcc Transceiver Front-end Technology Research

LTCC is a highly integrated multi-layer wiring package technology in MCM-C, which is able to implement the millimeter-wave microwave circuit with miniaturization, high integration and high reliability. In this paper, our major subject is in use of LTCC packaging technology to achieve the integrated design in its multi-layer substrates for millimeter-wave transceiver components and its functions.This paper introduces the basic situation of LTCC technology and features, and in full knowledge of LTCC technology advantages and disadvantages, we analyze the microwave circuit design of millimeter-wave processes to make the solid theoretical groundwork, and to lay a good foundation for implementation components function.The main work in this paper is that with a carefully analysis of the domestic and foreign development of the LTCC millimeter wave components, we design the several key components of the system, make a reliable system design, implement and debug the system successfully.First, we research and design transition results of the 8mm and 3mm bands which are the key band in millimeter-wave circuits. Second, we design the bandpass filters for the important bands the L-band, X-band, and Ka-band in the components. Then, we analyze the layer-to-layer interconnection structure of the multi-layer board.Finally, using the above techniques, the focus of this paper is to design Ka-band transceiver components, building and debugging the components to implement their functions.