Millimeter-wave Ltcc Transceiver Components Research

Low-Temperature Co-fired Ceramic (LTCC) technology is one type of Co-fired ceramic multi-chip module (MCM-C), which is a high-integration and multilayer- printed packaging technology. Its three-dimension (3D) structure brings a bran-new design conception and methods into the domain of traditional microwave and millimeter-wave circuits & systems. The focus of paper is that, based on LTCC packaging technology, integrate the millimeter-wave transceiver module into the LTCC multilayer substrate. This is an important step in the process of realizing compact, high-performance and low-cost millimeter-wave modules.First of all, the fabrication-flow and properties of LTCC technology are presented, especially the advantages and drawbacks.The research focus of this paper is to make breakthroughs about several key-technologies of LTCC transceiver modules. According to design target and LTCC technology, the system topology is presented. The key-technologies are also confirmed, including a novel broadband LTCC waveguide to microstrip transition for millimeter-wave applications, LTCC buried bandpass filter used in LO-chain at X-band, LTCC millimeter-wave SIW bandpass filter, and microstrip to stripline connection structure. After fabricating and testing, experimental data is obtained, which is very helpful to the module's realization.Finally, using ADS simulation software, the system-level simulations for LO multiplying branch, receiver branch and transmitter branch are carried out separately. Feasibility of transceiver module is proved again.