Server, The Thermal Characteristics Of Numerical Modeling And Optimization Design

Thermal analysis and design are getting a very essential task that must be considered in the design and research of modern electronic equipment, and consequently, software of numerical simulation based on finite volume method (FVM) has been widely used to predict the thermal characteristic of electronic equipment. Therefore, the numerical modeling method of thermal characteristic of the 2U stack server is studied, and then initial design is optimized by the application of optimal design method. The works carried out in the paper can be summarized as follows:1. The theory and the construction method of numerical simulation on thermal analysis simulation are studied. The process of control equation dispersed by first-order upwind format, construction and solving of SIMPLEST algorithm based on staggered grid and the modeling of turbulence are depicted respectively.2. The method of thermal simulation modeling of server is studied. The influence of Environment elements on the thermal performance is discussed. The setting of solving domain is conformed. The reason of the adoption of thick-wall case is analyzed. Modeling method of PCB is studied, and the shortage of it is pointed out. The method of thermal network compact model of packaging chip is presented. the influence element on the thermal and fluid performance of perforated plate is studied, and the setting suggestion is provided. Modeling process of fan is introduced. The influence is analyzed when volume damping is used to construct the power supply. The importance of mesh is emphasized when the detailed numerical model of heat sink is constructed. Common problems happened during the solving is discussed, and then solutions are offered. The influences of t turbulence model and radiation on the result are studied respectively.3. The layout scheme of the front chips is conformed after the effect of the distance between the outlet of fan and front chips on the thermal performance of front chips is analyzed. Sequential optimization (RO) based on design of experiment (DoE) is adopted to optimize the situation of the back chips, which results in improving the thermal efficiency of back chips. 4. Theory and method of the design of heat sink is presented. The effect of different types of heat sinks applying to the server is analyzed, and then the advantage of straight fin heat sink is concluded. The effect of material and thickness of bottom board of the heat sink is analyzed. Basic theory of response surface method(RSM) is presented, and response surface optimization(RSO) is applied to the optimal design of the structure of the fin. The final design improves the thermal efficiency of the server significantly.