Numerical Analysis Of Thermal Mechanicalcoupling For The Structure Of TSV

Along with the progress of science and technology, electronic device gradually towards to the direction of integration and miniaturization, thermal dissipation is getting more and more attention in its field, heating effect can result in a series of problems, for example, electronic device performance is not stable, failure or even damage. Currently the mainly design method of integrated circuit is combining the traditional experiments and numerical simulation method.According to the structure of the packaging of TSV, establish numerical analysis model, analyze steady-state and transient thermal mechanical coupling by using the finite element software. Find the peak of temperature, stress, strain and its regularities of distribution by numerical analysis, and discuss the characteristics of the coupling effects of different power cycle loading and package structure after deformation, then analyze and compare the results. In addition, considering the uncertainty of the parameters, make analysis of the uncertainty interval by the single and multiple parameter combinations respectively, getting the response of uncertainty range of the thermal mechanical coupling of TSV model.According to the thermal problems of loaded TSV model, this paper discuss the effects of different thermal mechanical coupling of TSV model structure and explore the impact of relevant factors, the following aspects of work are carried out, the study includes:(1)According to the thermal problems of TSV laminated packaging, analyze steady-state thermal mechanical coupling by using finite element software, discuss the peak and its distribution of location, and make comparative analysis of the results of thermal mechanical coupling about different structural TSV models.(2) Using the steady-state analysis of ten nodes temperature TSV model, analyze and identify the heat source in package by ant colony sourcing methods.(3) According to the conditions of the different stages of cyclic loading, make analysis of the transient thermal mechanical coupling of multi heat TSV laminated packaging. Analyze the effects of model thermal mechanical coupling by discussing the high-power and low-power cyclic loading conditions, and further explore the characteristics of the coupling effects of different hole-spacing and shape, and compare the results for the possible correspondence.(4) According to the uncertain parameter problem of TSV package model, by combining interval finite element method and interval perturbation theory, respectively make analysis of the uncertainty interval by the single and multiple parameter combinations, getting the response of uncertainty range of the thermal mechanical coupling of TSV model.Through the certainty research and uncertainty research of thermal effect on TSV packaging, analyzes the influences and impacts on thermal effects and parametric uncertainties caused by different TSV structures. Related research findings can be applied to the reference of TSV model structure optimization design, particularly in terms of thermal design.