Millimeter-wave Ltcc Circuit Design Technology Research

Low-Temperature Co-fired Ceramic (LTCC) technology is one type of Co-fired ceramic Multi-Chip Module (MCM-C), which is a high-integration and multilayer- printed packaging technology. Its three-dimension (3D) structure brings a bran-new design conception and methods into the domain of traditional microwave and millimeter-wave circuits and systems. Using LTCC technology, the theory and design for the millimeter-wave circuits and systems are present in this thesis.Firstly, the millimeter wave and its characteristics, the millimeter wave planar integrated circuits and its development, and the trend of LTCC in home and abroad are introduced. Then, the fabrication-flow and properties of LTCC technology are presented, especially the advantages and drawbacks.Using LTCC technology for the millimeter-wave circuits, the passive components (including waveguide-to-microstrip transition, microstrip to stripline connection structure, X-band and millimeter bandpass filter) are dissertated. These passive components are researched, designed and measured. Some of them (such as waveguide-to-microstrip transition, microstrip to stripline connection structure, and millimeter SIW bandpass filter) get good results and are practical in further use. The other X-band buried digital filter and millimeter buried filter are not so good because the processing errors and further amelioration need to be developed to reduce the effect of processing errors.Finally, based on these works, the millimeter-wave LTCC transceiver (including LO chain, receiver chain, transmitter chain and direct current network) is designed and measured, which is helpful for the further research about the LTCC millimeter circuits applications.