Reliability Of MCM Research And Application Of CVD Diamond Material

With the rapid development of integrate circuit and electronic products various packaging modes and packaging technologies are developed. Multi-Chip Module(MCM) packaging technologies rapidly develop after surface mounting the technology (SMT) appearing. It enhanced the electronic products packing density, improved frequency characteristic and transmission speed and so on. Because of increasing along with the product operating frequency and the power promotion, its electromagnetic compatibility and the thermal radiation gradually become the important technical topic which the people have to consider.This paper summarized the related questions which MCM faces, has analyzed several aspects which influence product's parameter of electromagnetic compatibility, Introduced the method about analyzing electromagnetic performance of the product by using CST which is electromagnetism simulation software, gives the suggestions about improvement according to the result .Introducing heat exchange theory and finite element theory, and deducing the theory that applies finite element method to thermal analysis. Create the thermal model according to structure of MCM, and analyze temperature field when material in the substrate changed.The paper introduced product's reliable performance after using the CVD diamond .Do a simulation about electromagnetic compatibility and thermal radiation to observe the advantage of CVD diamond.Results in the paper will supply references to electromagnetic and thermal designs of multi-chip module packaging based on diamond material.