Dynamic Model Of Wires And Cables And Its Influnce On Wire Bonder

In the domain of Integrated Circuit (IC) industry, with the ever decreasing size of chips, increasing density of I/O ports, improving packaging technique and material property, it poses more demanding requirement on the dynamic behavior and positioning accuracy of IC packaging devices. In order to reduce the cost, shorten the research time and improve the efficiency, MSC software could be utilized to build up a prototype, meanwhile some external factors that affect the performance of the wire bonding machine should be identified to make the simulation more accurate. Wire and cables are one of those external factors, which provide power and transmit control signal. However, they need to move together with the XY table in high speed, during the procession, the repeated deformation and the rubbing friction among cables will pose a bad influence on the dynamic behavior and positioning accuracy of the table.In this paper, the author first builds up a mathematical model of the wires and cables, which is focusing on the large nonlinear deformation of the wires and cables during the procession of wire bonding, then choose a feasible identification model.Secondly, with the help of B&K vibrometer, using the impulse hammer to trigger vibration at low frequency in order to measure the concerned parameters: stiffness and damping. Next, with regard to the wire bonder head motion in bonding process, the author carries do research on the trajectory planning, meanwhile, designs a proper controller to control and compensate the interferences of the wires and cables to enable the table to meet the expected requirement of high speed and high accuracy. Last, based on the commercial software of Solidworks, Adams and Matlab, the author uses the built model to do the co-simulation and the results indicate that the model can well emulate the performance of the wire bonder working in high speed.