Development Of Unsoldering And Dismantling Equipment For Components On Post-use Printed Circuit Board

With the rapid upgrading and renewing of electronic and electrical products,the amount of electronic wastes including printed circuit board (PCB) is increasing quickly. The realization of electronic components'non-destructive unsoldering separation from PCB board has ever been a tough challenge for PCB's recycling. According to the post-use PCB's structural feature,based on the analysis and comparison of existing unsoldering methods,liquid solder tin is selected to heat and melt the solders of PCB,and the mechanical impact and vibration are used to achieve the electronic components'unsoldering purpose.The unsoldering and dismantling model is established aiming at two typical components,the surface mount devices (SMD) and through-hole devices(THD). Combined with unsoldering experiments, the key unsoldering parameters are determined,the unsoldering technology for post-use PCB is presented which is suitable for Chinese condition,and the structural design project of unsoldering equipment is also studied out. In the process of the equipment's being developed,the virtual prototype technique is employed to implement the dynamic simulation for the mechanical system of the unsoldering equipment. The structural parameters of the equipment are optimized,the developing period is shortened and the developing cost is lowered. The smoke and dusts generated in the procedure of unsoldering are collected and purified properly. The control system for unsoldering equipment is designed and the automatic operation is fulfilled.Finally the unsoldering prototype is developed and put to continuous use in a recycling demonstrating line of electrical home appliances. Practice shows that the equipment has advantages of efficiency,safety,reliability,energy-saving and environmental protection,moreover,the damage rate of the electronic components is low.